SUPERPACS consortium
The SUPERPACS consortium comprises of 7 partners from all over Europe: Belgium (1), France (2), Germany (1), Italy (1), Austria (1), and Denmark (1). The entire supply chain for design, manufacturing, assembly and testing is represented inside the project consortium.
Imec is a world-leading independent research centre in the field of semiconductor and nanotechnology. Imec offers cutting-edge technologies to help satellite builders develop custom payload components that cannot be sourced from traditional foundries or engineering houses. From early-stage innovation to flight-ready hardware, imec supports dedicated development-on-demand projects tailored to your specifications. Its expertise includes integrated imagers, radiation-hardened circuits, optical transceivers, and efficient power conversion systems – designed to operate reliably in the harsh conditions of space. As satellites become smaller and more capable, imec leads in scaling technologies while enhancing performance. Imec also brings extensive experience in space evaluation and qualification (ESCC2269000 and ESCC9000), including the development of custom test hardware and full supply chain management for flight module screening. In SUPERPACS, coordinator imec contributes with two research groups:
The Centre for Microsystems Technology (CMST) specializes in packaging & integration technology for electronic and photonic integrated circuits, enabling novel semiconductor microsystem applications. Based on its long heritage with high-density interconnections and packaging for space applications, CMST is coordinating the SUPERPACS project.
Imec’s thermo-mechanical modelling work is performed within its innovative systems, solutions and applications (ISSA) expertise center. The activities within the project focus on developing and validating a simulation-driven reliability assessment methodology for advanced System-in-Package (SiP) technologies intended for space applications.
A Joint Venture between Thales (67%) and Leonardo (33%), Thales Alenia Space is a global space manufacturer delivering, for more than 40 years, high-tech solutions for telecommunications, navigation, earth observation, environmental management, exploration, science and orbital infrastructures. Two divisions of Thales Alenia Space are partner in SUPERPACS, both able to design, develop, integrate and test, platform equipment as well as payload ones, including system & subsystem, with a strong orientation on technology development.
The division of Thales Alenia Space in Toulouse, France (TAS-F) is mainly prime contractor and integrator of end-to-end telecommunication program systems. In the SUPERPACS project TAS-F leads the advanced SiP design rules and process design kit (PDK) activities within SUPERPACS, leveraging its heritage in system design for space payloads and RF subsystems. TAS-F will also develop the assembly buildings blocks required to leverage the assembly of advanced 2.5D SiP structures on their shared SiP assembly line SIPACK with Synergie CAD.
Thales Alenia Space in L’Aquila, Italy (TAS-I) is mainly a prime contractor for navigation and earth observation programs. In this project, TAS-I will derive the SiP specifications and test campaign plan from relevant mission and system requirements. Its manufacturing line in L’Aquila will support the SUPERPACS demonstrator assembly, extending the ESA-certified manufacturing domains to include advanced SiP.
SYNERGIE CAD PSC provides ‘turnkey’ back-end solutions to fabless companies and European semiconductor start-ups, from small to large volumes, acting as the European aggregator for major Tier1 OSATs. In addition, this European assembly & test house offers unique in-house global engineering & manufacturing solutions for small and mid series .
In addition to the design of the SiP demonstrators, Synergie CAD is responsible for the advanced SiP assembly technology development, such as fine-pitch flip-chip, underfill, and SiP integration. They will industrialize the SiP assembly technology and run the SIPACK open line, with multi-sourcing on raw materials and tooling to secure deliveries.
AT&S is a world leading high-tech company for IC substrates & PCB design and manufacturing, headquartered in Leoben, Austria. It has over 14.000 employees in 6 production sites and 9 sales offices worldwide. The AT&S IC Substrate Competence Center in Austria is a first-of-its-kind smart, sustainable manufacturing and development center for next generation ultra-high-density organic substrates. The R&D Line is part of the Competence Center and is equipped with 25 dedicated machines for R&D on organic substrate build-ups. Separated from but connected to high-volume manufacturing fosters rapid innovation without interferences. The R&D Line focuses on IC substrates and advanced packaging, supporting collaboration with universities, research organizations, start-ups, and industry partners. It plays a role in strengthening Europe’s capabilities in high-performance computing and electronics.
Within the SUPERPACS project, AT&S develops and supplies organic UHDI interposer prototypes and manufacturing inputs for design-rule extraction. At the end of the project, AT&S will provide UHDI organic interposer manufacturing routes and sourcing analysis (European footprint, multi-sourcing) to enable scale-up and price/quality alignment for space and adjacent markets.
The Leibniz Institute for High Performance Microelectronics (IHP) is one of the world’s leading research institutions in the field of silicon/germanium electronics. In this field, it has extensive, closely coordinated expertise in semiconductor technology, materials research, high-frequency circuit design and system solutions. Its electronic and photonic-electronic technologies and circuits are among the most powerful in the world. In the speed of silicon-based transistors, IHP holds the world record with 720 GHz maximum oscillation frequency. The institute has a pilot line that manufactures circuits using its high-performance SiGe BiCMOS technologies. Through its research and manufacturing services, IHP contributes significantly to the innovative strength of Germany and Europe, especially in the field of ultrahigh-frequency electronics. The institute’s research results are applied in socially important areas such as semiconductor manufacturing, wireless and power broadband communications, health, space, Industry 4.0 or Agriculture 4.0 and mobility.
IHP is developing the SUPERPACS silicon interposer technology and its associated device portfolio for SIP integration. IHP will develop and offer their silicon interposer to the SUPERPACS project partners via multi-project wafer (MPW) runs with pathways beyond space (RF, aeronautics).
HYTEK is a dynamic provider of technological training courses, IPC and ESA certification, consultancy, test and failure analysis for the electronics industry. Our mission is to boost the competitiveness of electronics industries by providing enhanced knowledge and higher quality and reliability in electronic development and manufacturing. HYTEK has more than 30 years of experience within the field of test and trouble shooting for high-end electronics.
HYTEK leads the SUPERPACS reliability & technology assessment. They prepare ECSS/ESCC-aligned test planning and execute environmental & reliability testing for aerospace electronics.
