Sustainable production line delivering advanced packaging for space missions
The SUPERPACS project is funded by the European Union under Grant Agreement no. 101296380, through the Space R&I Work Programme of the European Commission. See CORDIS project page for more details.
Europe’s future satellites will require increasingly powerful and compact electronic systems to support communication, navigation, earth observation and space-security services. SUPERPACS is developing the advanced packaging technologies needed to integrate these next-generation devices while strengthening Europe’s technological sovereignty and industrial competitiveness.
The project focuses on advanced System-in-Package solutions that enable multiple semiconductor chiplets to be combined within a single module. By developing both silicon interposers and ultra-high-density organic interposers, SUPERPACS is creating the foundations for high-performance, energy-efficient and reliable space electronics. To accelerate industrial adoption, the project is establishing an open European pilot line and delivering the design tools, manufacturing processes and qualification methods needed to bring these technologies into future space systems.
SUPERPACS covers the complete innovation chain, from material selection and characterisation to design, simulation, fabrication, assembly, testing and reliability validation. The technologies developed in the project target future applications in European space programmes, including satellite communications, navigation and earth observation. Over its four-year duration, SUPERPACS will mature advanced packaging technologies from laboratory-scale developments to representative demonstrators suitable for future space missions.
The consortium brings together leading European research organisations, space-industry stakeholders, technology providers and test laboratories with expertise spanning advanced packaging, electronics manufacturing and space qualification. Launched in June 2026, SUPERPACS is building a European ecosystem capable of delivering advanced packaging solutions for the next generation of space electronics.
