European supply chain for advanced packaging for space applications
SUPERPACS is developing two complementary advanced packaging platforms: a silicon interposer and an ultra-high-density interconnect (UHDI) organic interposer. Together, these technologies will enable the integration of multiple chiplets into compact, high-performance System-in-Package (SiP) solutions tailored to the demanding requirements of future space electronics. To support industrial adoption, the project will establish an open SiP pilot line that brings together design, manufacturing, assembly and testing capabilities within a European ecosystem. In parallel, SUPERPACS will deliver Process Design Kits (PDKs) that provide designers with the models, rules and technology data needed to implement advanced packaging solutions more efficiently and accelerate the transition from concept to space-ready hardware.
